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According to the latest research by SkyQuest Technology, Global IC Packaging Market was valued at USD 78.18 billion in 2021, and it is expected to reach a value of USD 147.57 billion by 2028, at a CAGR of more than 9.50% over the forecast period (2022 – 2028).
The IC packaging shields IC chips from the elements and provides a secure electrical connection for chip installation on circuit boards. The high demand for high-speed, high-integration, and low-power ICs is accompanied by significant advancements in electronics technology, such as AI and cloud computing. It is a supporting case that protects silicon wafers, logic units, and memory from physical damage and corrosion during the final phases of the semiconductor manufacturing process. It allows the chip to be connected to a circuit board. Because different ICs have varied packaging requirements, the IC Packaging market is expected to increase.
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The increasing demand for AI-based applications in a variety of industries (including healthcare, telecommunications, energy, finance, transportation, agriculture, manufacturing, aerospace, and defense) will create new opportunities for semiconductor manufacturers and suppliers. AI will also accelerate semiconductor manufacturing by improving chip performance, lowering production costs, and increasing output. As a result, the IC packaging market is expanding. Because packaging is an early stage in the electronics value chain, the growth of the IC packaging market is heavily influenced by the growth of the semiconductor market. Packaging can be done in-house or outsourced by foundries. Qualcomm, a semiconductor and telecommunications equipment manufacturer, for example, uses OSATs to conduct its packaging operations.
Read market research report, ” Global IC Packaging Market By Type (DIP, SOP, QFP, QFN, BGA, CSP, LGA, WLP, FC, Others), By Bonding Techniques (Wire Bonding, Flip Chips, Wafer Level Packaging, Others) & By Application (Memory IC, Logic IC, Discrete, SIP, Other) & By Region – Forecast and Analysis 2022-2028” by SkyQuest
The Asia-Pacific region is expected to dominate the IC packaging market with a share of more than 90%. The presence of major IC packaging and assembly companies in the region is a major factor driving the regional market growth. The Asia-Pacific region is widely regarded as a major global hub for IC assembly and packaging. Taiwan, China, Japan, and South Korea are among the major contributors to the market’s regional expansion.
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The wire bonding segment of the market is expected to have the largest market share. Gold wire bonding, copper wire bonding, and aluminum wire bonding are all types of wire bonding. The wire bonding technique is the most common and traditional method of bonding ICs, as well as the most cost-effective. The introduction of other advanced bonding techniques, on the other hand, is expected to limit the segment’s growth. The water level packaging bonding technique, on the other hand, is expected to grow the fastest in the market. During the forecast period, the wafer-level packaging bonding technique is expected to grow at the fastest CAGR of 10.1%. The industry manufacturers are shifting toward advanced bonding techniques such as wafer-level packaging and flip-chip bonding techniques because they offer numerous advantages over traditional bonding techniques.
The Global IC Packaging market is relatively fragmented and competitive. To stay afloat in the market, the major players are constantly implementing various growth strategies. Product launches, innovations, mergers and acquisitions, collaborations and partnerships, and intensive R&D are some of the growth strategies used by these key players to compete in the market. The major market participants are also constantly focused on R&D in order to provide industries with the most efficient and cost-effective solutions.
The report published by SkyQuest Technology Consulting provides in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions.
Drivers ● Rising government support is expected to drive the semiconductor and integrated circuit packaging market. The Creating Helpful Incentives to Produce Semiconductors for America Act, for example, establishes investments and incentives to support U.S. semiconductor manufacturing, R&D, and supply chain security. Restraint ● The industry is not evenly distributed and is dominated by a few countries, primarily the United States, Taiwan, South Korea, Japan, China, and Europe. No single region controls the entire production stack. Asian countries produce 57% of semiconductor materials, 56% of wafer fabrications, and 70% of memory. What does this Report Deliver?
● Market Estimation for 20+ Countries ● Customization on Segments, Regions, and Company Profiles ● 100+ tables, 150+ Figures ● Global and Country IC Packaging Market Trends ● Comprehensive Mapping of IC Packaging Industry Parameters ● Attractive Investment Proposition ● Competitive Strategies Adopted by Leading IC Packaging Market Players ● IC Packaging Market drivers, restraints, opportunities, and impact on the market ● IC Packaging Market growth rate till 2028 ● Regulatory scenario, regional dynamics, and IC Packaging market insights of leading countries in each region ● Segment trends and analysis ● IC Packaging Market Opportunity analysis by region and country ● IC Packaging Market Segmentation opportunity and growth ● Porter’s five force analysis to know the market’s condition ● Pricing analysis ● Parent market analysis ● Product portfolio benchmarking SkyQuest has segmented the Global IC Packaging Market based on the Type, Bonding Techniques, Application and Region: ● Global IC Packaging Market by Type (Revenue, USD Billion, 2021 – 2028) o DIP o SOP o QFP o QFN o BGA o CSP o LGA o WLP o FC o Others ● Global IC Packaging Market by Bonding Techniques (Revenue, USD Billion, 2021 – 2028) o Wire Bonding o Flip Chips o Wafer Level Packaging o Others ● Global IC Packaging Market by Application (Revenue, USD Billion, 2021 – 2028) o Memory IC o Logic IC o Discrete o SIP o Other ● Global IC Packaging Market Regional Outlook (Revenue, USD Billion, 2021 – 2028) o North America US Canada o Europe Germany France UK Italy Spain Rest of Europe o Asia Pacific China India Japan Rest of Asia Pacific o Central & South America Brazil Rest of CSA o Middle East & Africa GCC Countries South Africa Rest of ME
Key Players of the Global IC Packaging Market
• ASE Technology Holding Co. Ltd. (China) • Amkor Technology (US) • JCET (China) • SPIL (China) • Powertech Technology Inc. (China) • TongFu Microelectronics Co. Ltd. (China) • Lingsen Precision Industry Co. Ltd. (China) • Sigurd Corporation (China) • Greatek Electronics Inc. (China) • OSE Corp. (China) • Tianshui Huatian Technology Co. Ltd. (China) • UTAC Holdings Ltd. (Singapore) • King Yuan Electrics Co. Ltd. (China) • ChipMOS Technologies Inc. (China) • FATC (China)
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