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According to our latest market study, titled “Embedded Die Packaging Technology Market” The semiconductor industry is evolving with innovations in product offerings to support digitalization. The rising demand for IoT-based electronic devices to enhance connectivity is further propelling the market growth. The advent of smart solutions such as smart homes, factories, and cities has created a lucrative opportunity for the market players to develop new electronic devices, having IoT compatibility. The rising trend of miniaturization of electronics to optimize space and design is fulfilled with embedded die packaging technology. Companies prefer embedded die packaging technology for new electronic devices to enhance the performance with compactness. Advanced packaging technologies have the capacity to resolve the micro-chip performance requirements. The embedded die packaging technology offers a solution over technical challenges such as thermal management, power consumption, and product dimension. The embedded die packaging technology is gaining significant adoption from North America, Europe, and Asia. In contrast, remaining countries from the Middle East & Africa and South America region might turn into potential markets for embedded die packaging technology during the forecast period.

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List Of TOP KEY PLAYERS in Embedded Die Packaging Technology Market Report are –

ASE GROUP; GENERAL ELECTRIC COMPANY; FUJIKURA LTD.; AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT; AND MICROSEMI CORPORATION – PROMINENT MARKET PARTICIPANTS IN EMBEDDED DIE PACKAGING TECHNOLOGY MARKET

ASE Group; General Electric Company; Fujikura Ltd.; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; and Microsemi Corporation are the five key market players operating in the embedded die packaging technology market ecosystem. Due to fragmented and evolving nature of embedded die packaging technology market ecosystem; presence of a large number of local and regional players; and involvement of players that belong to various stages of the ecosystem such as outsourced assembly and test companies (OSATs) and Integrated Device Manufacturers (IDMs), it is difficult to shortlist the top 5 players in the global market and hence, we have listed down above mentioned five players by considering following parameters: overall revenue, brand image & industry expertise, current advanced packaging and embedded die packaging portfolio and related products, research and development capabilities, patents, new product launches, partnerships, mergers & acquisitions and other market related activities.

There are various other notable players in the global embedded die packaging technology market ecosystem such as Infineon Technologies AG; Taiwan Semiconductor Manufacturing Company, Limited; Shinko Electric Industries Co., Ltd.; Schweizer Electronic AG; and Amkor Technology, Inc. which are profiled in this report. In addition to the ten players profiled in the report, there are several other global, regional, and local players operating in the global embedded die packaging technology ecosystem/value chain which were studied during the course of the study to get a holistic view of the entire market.

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Embedded Die Packaging Technology Market : Segments

Electronics gadgets are being developed using small form factor electronic components to enhance the space and improve the final product design. Customers are preferring compact, small-sized handheld electronic devices offering maximum features. To enhance user experience, companies are developing miniaturized electronics to integrate maximum components on a single die. Integrating maximum number of components, such as sensors and processor, in a single die offers enhanced features for customers. Rising techno savvy population is one the major factors for the miniaturization of electronics as it has created stiff competition in market players to offer maximum number of features in a single device.

Packaging technology has evolved rapidly to enhance the packaging of small electronic components in a single die to optimize the space in the final device. In IC package substrate platform, the semiconductor die gets embedded within standard PCB (printed circuit board) material, such as laminated layers and lead frames, at the time of formation of the substrate. The platform offers various benefits, such as miniaturization & design flexibility; improved reliability and mechanical stability; and improved thermal & electrical thermal performance. In terms of platform, the embedded die packaging technology market is segmented into IC package substrate, rigid board, and flexible board.

In terms of application, the global embedded die packaging technology market is segmented into smartphones & tablets, medical and wearable devices, industrial devices, security devices, and others. The emerging need of microelectronics from various industry verticals, including automotive, healthcare, and consumer electronics, for small-form factor-based applications are supporting the market growth. Growing trend of size reduction and improving functionality of electronic devices are boosting the adoption of embedded die packaging technology for cellphones and tablets. The die and chip size play a vital role in a smartphone design, as manufacturers are urging for a new solution to take the minimum space possible.

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With tables and figures, helping analyze worldwide Global Embedded Die Packaging Technology Market Forecast provides key statistics on the state of the industry and is a valuable source of guidance and direction for companies and individuals interested in the Market.

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The Insight Partners is a one stop industry research provider of actionable intelligence. We help our clients in getting solutions to their research requirements through our syndicated and consulting research services. We specialize in industries such as Semiconductor and Electronics, Aerospace and Defense, Automotive and Transportation, Biotechnology, Healthcare IT, Manufacturing and Construction, Medical Device, Technology, Media and Telecommunications, Chemicals and Materials.

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